To encapsulate, seal and insulate delicate electrical and electronic components from damage, many manufacturers rely on tough, flexible polyurethane potting compounds.  The products are economical and easy to pour over fragile printed circuit boards, microelectronics and wiring.  During curing, polyurethane encapsulants are characterized by low shrinkage to prevent stress on sensitive electronic components.  In service, hydrophobic elastomers insulate electronics from moisture damage and waterproof submersible components.  Polyurethanes are heat resistant to protect circuitry during thermal cycling of completed assemblies.  The materials are also formulated with good dielectric properties and low glass transition temperatures to retain flexibility even at low temperatures.

Innovative Polymers manufactures three Shore A hardness polyurethanes specifically designed for use in electrical and electronics applications.  IE-6000, IE-7000 and IE-8000 polyurethane potting materials are two-component systems that gel in less than 20 minutes.  Viscosities are low for easy handling and the cured products are heat resistant.  Key properties include:

• Specific gravity <1.0
• Hydrophobic
• Good tear strength
• High elongation
• Low glass transition temperature
• Good dielectric properties:
  • Volume Resistivity: 2.0x1016 Ω-cm
  • Surface Resistivity: 2.8x1016 Ω-cm
  • Dielectric Strength, at 25ºC: 570 volts/mil
  • Dielectric Constant, at 25ºC: 2.4
  • Dissipation Factor, 1 kHz at 25ºC: 0.014